RTL Design & Verification
VHDL, Verilog and SystemVerilog RTL development with directed and constrained-random verification using C/C++, SystemVerilog and UVM.
ASIC / SoC Engineering
From architecture
to GDS.
Digital ASIC and SoC engineering from architecture and RTL through synthesis, DFT, physical implementation and sign-off.
Engineering depth across the digital implementation flow.
ANKASYS supports teams where specialist implementation capability is needed, from early RTL decisions to physical implementation and verification closure.
Architecture & RTLDigital architecture, microarchitecture and synthesizable RTL development.
Synthesis & ConstraintsTiming-aware synthesis, constraints development and implementation preparation.
DFTScan, ATPG-oriented design considerations and DFT engineering support.
Physical ImplementationRTL-to-GDS implementation support, timing closure and sign-off oriented execution.
DIGITAL SILICON FLOW
One engineering flow, multiple hand-off points
Architecture
RTL
Implementation
Sign-off
RTL → GDSend-to-end scope
ASIC + FPGAshared digital expertise
Verificationintegrated mindset
REAL ENGINEERING CONTEXT
Implementation work, seen outside the diagram.
Architecture, RTL and implementation ultimately become physical silicon. These ANKASYS-owned wafer photographs add real semiconductor context without exposing customer layouts or confidential project material.
Need specialist implementation capacity?
Discuss architecture, RTL, synthesis, DFT or physical implementation needs with ANKASYS.
END-TO-END SILICON ENGINEERING
From architecture to signoff.
ANKASYS supports ASIC and SoC programs across RTL design, synthesis, DFT, physical implementation, signoff and post-silicon validation.
Synthesis & DFT
RTL-to-netlist implementation, constraint development, DFT concept development and implementation, and timing closure support.
RTL2GDSII & Signoff
Floorplanning, placement, clock-tree synthesis and routing, supported by DRC/LVS, STA, formal equivalence, power and IR-drop analysis.
Post-Silicon & System Design
ATE and lab validation, plus PCB, firmware and software engineering for system bring-up.
50+successful block & top-level tapeouts
180 nm → 22/28 nmexperience across legacy, low-power and high-performance process technologies
Mixed-signal to digitalRF-digital-on-top, FDSOI, embedded controllers, accelerators and SoC implementations